UPC 618996741663
Barcode for Micro Center Intel Core i7-11700K Desktop Processor 8 Cores up to 5.0 GHz Unlocked LGA 1200 125W Bundle with ROG Strix Z590-E Gaming WiFi Motherboard DDR4 4X M.2, USB 3.2 Type-C Aura Sync RGB
Scannable Barcode for UPC 618996741663
Sellers
| Marketplace | Price | Updated |
|---|---|---|
| $759.99 | 05/18/2021 05:50:54 GMT - Details |
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Attributes
| Attribute | Value |
|---|---|
| Binding | Personal Computers |
| Brand | Inland |
| Color | CPU 11th Gen I7-11700K + ASUS ROG STRIX Z590-E GAMING WIFI Motherboard Bundle |
| EAN | 0618996741663 |
| Manufacturer | INLAND |
| UPC | 618996741663 |
Description
- 11th Generation Intel i7-11700K CPU Processor and ASUS Prime TUF GAMING Z590-PLUS WIFI Motherboard bundle combo, maximize performance, speed and connectivity whenever you game, design, record, stream, web browsing, document editing and more. Pack in a bundle, compatibility guarantee, purchase with confidence
- Intel Core i7-11700K Desktop Processor. 8 Cores 16 Threads; 4.6 GHz up to 5.0 GHz Turbo Unlocked; 14 MB Intel Smart Cache; Intel Iris Xe Graphics 32 ; 125W TDP; LGA1200 Sockets Supported, a fan or heat sink not included
- CPU Support Maximum Memory Capacity 128 GB, DDR4-3200 MHz, No ECC memory, up to 2 memory channel, 45.8 GB/s max memory bandwidth. Built-in Intel UHD Graphics 630 , Intel Optane Memory Supported.
- DIY Friendly Design: ASUS ROG Strix Z590-E Gaming WiFi 6E ATX Gaming Motherboard. M.2 Q-Latch, pre-mounted I/O shield, BIOS FlashBack, Clr CMOS button, Q-Code and FlexKey.
- Unmatched Personalization: ASUS-exclusive Aura Sync RGB lighting, including RGB header and Gen 2 addressable headers. ALC4080 with Savitech SV3H712 amplifier, along with DTS Sound Unbound and Sonic Studio III
- Intelligent Control: ASUS-exclusive tools AI Overclocking, AI Cooling, AI Networking and Two-Way AI Noise Cancelation to simplify setup and improve performance.
- Optimal Power Solution: 14+2 power stages with ProCool II power connector, high-quality alloy chokes and durable capacitors to support multi-core processors
- Optimized Thermal Design: VRM and aluminum I/O heatsink, L-shaped heatpipe, Triple onboard M.2 heatsinks, including an M.2 backplate for improved cooling for PCIe 4.0 M.2 slot
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