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UPC 739551820361

Barcode for BGA Stencils, 27pcs Universal Directly Heat BGA Reballing Net Stencils Templates for Soldering Accessories, Welding Accessories

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Marketplace Price Updated
$12.01 05/04/2022 16:28:36 GMT - Details

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Attributes

Attribute Value
Brand Hongzer
EAN 0739551820361
Manufacturer Hongzer
MPN Hongzerr7emkx0sf5
UPC 739551820361

Description

  1. 304 Stainless Steel -- These stencils are made of high quality 304 stainless steel, the thickness of steel mesh is perfect. 27 PCS/Set, enough to meet your various needs.
  2. Not Easy To Deform -- They can be heated by the hot air machine, these stencils are not easy to deform when heated. Cooperate with ordinary air gun, the manual reballing can be carried out, no need to purchase another reballing platform.
  3. Specially Designed -- It is specially designed for laptop, desktop, communication main board north-south bridge, and graphics card, etc all kinds of BGA chips. It is easy and quickly for reballing the BGA IC, useful and economical accessories for BGA soldering.
  4. Soldering Accessories -- The area of stencil is matched with the area of BGA chip, which can reduce the waste of solder ball. However, for the chip that the alignment of solder ball is uneven, or with a different spacing chips, this stencil is not applicable.
  5. Important Tips -- Leaded solder ball melting point 183 degrees, alloy SN63PB37 . Unleaded solder ball melting point 217 degrees Celsius. Alloy SN96.5 ag3cu0.5 . When heated directly with the air gun. Pay attention to adjusting air gun temperature. It doesn't need too high temperature. Otherwise, will result in the deformation of the stencils.

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